Outline* The shown information is the one as of the awarded date and might has been changed.
The DS1000 is a electrical discharge machining system that efficiently produces semiconductor wafers. The 0.1mm electrode wires rotated at equal intervals can slice 40 polycrystalline ingots at a time. Thermal non-contact machining enables faster slicing and a tighter cutting allowance than contact machining, producing more wafers from one ingot for more effective use of costly crystal materials.
Seiji Sato, Nagoya Works, Mitsubishi Electric Corporation
Shinichi Kato, Industrial Design Center, Mitsubishi Electric Corporation
Naoya Tsukamoto, Industrial Design Center, Mitsubishi Electric Corporation
- Already on the market